10th IEEE CPMT Symposium Japan (ICSJ)

November 10 – 12, 2021

A Hybrid Event of On-site and Virtual Meetings 

On-site Venue: Kyoto University Clock Tower Centennial Hall, Kyoto, JAPAN

Official link: https://www.ieee-csj.org/

Electronics Packaging for 5G and B5G

The IEEE UK and Ireland Photonics Society is proudly collaborating with the IEEE Electronics Packaging Society (EPS) in the IEEE CPMT Symposium Japan (ICSJ).

IEEE CPMT Symposium Japan (ICSJ) is one of the most widely recognized international conferences sponsored by the IEEE Electronics Packaging Society (EPS) and has been held annually in Kyoto in November.  This conference was inaugurated in 1992 as “The VLSI Packaging Workshop in Japan (VPWJ)” to provide a  platform for you to communicate and interact with global leaders in packaging technology. Later in 2010, this conference was renamed to “ICSJ” and ICSJ2021 is the 10th ICSJ meeting, or 19th conference since establishing  VPWJ. This year, ICSJ2021 will be a hybrid event of on-site and virtual meetings where several presentation options are available for the authors to select and the details will be announced on the official website at a later date. 

Electronics Packaging for 5G and B5G

The 5G commercial services have just began and provide higher  transmission rate, lower latency, greater capacity of remote execution, and larger number of connected devices.  The 5G advantages will dramatically advance the performance of IoT services, edge computing, augmented reality  (AR) / virtual reality (VR), autonomous mobility, as well as artificial intelligence (AI), and future “beyond 5G (B5G)”  mobile network will eventually provide 5G and B5G services to realize Internet of Everything (IoE) services. In  2021, our focus is on key electronics packaging technologies for the next-generation mobile networks and their  applications for 5G and B5G services.

The main topics are:

  • Photonics
  • Advanced Packaging
  • Process & Material
  • Power & Automotive Electronics
  • Bioelectronics, and Sensing Technologies

Other topics include (but not limited to):

  • 3D Packaging & Chip-on-Chip
  • Advanced Fine Pitch Packaging, Micro Bumping, CSP
  • Board-Level Integration & Integrated Substrate
  • Laminated Materials & Processing, Materials for Packaging
  • Reliability & Failure Mechanisms
  • Packaging for High-Speed Electrical Interconnect
  • Signal Integrity / Power Integrity
  • RF Components & Modules
  • Additive Manufacturing, 3D Printed Electronics
  • Brain-like Neuromorphic Chip Assembly
  • Resilient Packaging for Autonomous System
  • Low Power / Low Temperature / Ultra Low Noise System Packaging

This conference is a perfect opportunity for you to communicate, interact, exchange technical ideas, and discuss  your latest novel research findings in 5G and B5G packaging technologies with experts from industry and  academia. In addition to the regular sessions, there is an “Early Career Researchers’ (ECR)” session for young  researchers with less than 2-year experience in their professions and all students including Ph.D. to hold fruitful  communications with the experts. The ECR sessions have been held as a poster session in the past conferences.

More information in https://www.ieee-csj.org/