IEEE CPMT Symposium Japan (ICSJ)

Electronics Packaging for 5G and B5G

The IEEE UK and Ireland Photonics Society is proudly collaborating with the IEEE Electronics Packaging Society (EPS) in the IEEE CPMT Symposium Japan (ICSJ). ICSJ is a widely recognized international conference sponsored by the EPS and has been held annually in Kyoto in November since 1992. ICSJ provides a platform for you to communicate and interact with global leaders in packaging technology.

The theme of this year is Electronics Packaging for 5G and B5G.  5G commercial services began to provide higher transmission rate, lower latency, greater capacity of remote execution, and more connected devices. 5G advances the performance of Internet-of-Things (IoT) services, edge computing, virtual reality (VR), autonomous mobility, as well as artificial intelligence (AI). The term Beyond-5G (B5G) describes the technical discussions of the future mobile network after 5G.

The main topics are:

  • Photonics
  • Advanced Packaging
  • Process & Material
  • Power & Automotive Electronics
  • Bioelectronics, and Sensing Technologies

Other topics include (but not limited to):

  • 3D Packaging & Chip-on-Chip
  • Advanced Fine Pitch Packaging, Micro Bumping, CSP
  • Board-Level Integration & Integrated Substrate
  • Laminated Materials & Processing, Materials for Packaging
  • Reliability & Failure Mechanisms
  • Packaging for High-Speed Electrical Interconnect
  • Signal Integrity / Power Integrity
  • RF Components & Modules
  • Additive Manufacturing, 3D Printed Electronics
  • Brain-like Neuromorphic Chip Assembly
  • Resilient Packaging for Autonomous System
  • Low Power / Low Temperature / Ultra Low Noise System Packaging

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